Ceramic Substrates And Packages For Electronic Applications

Among the ceramics employed as electronic substrates and packages the dominant material is alumina aluminum oxide al.

Ceramic substrates and packages for electronic applications.

At the same time the vacuum tight housings and substrates must. Hermetic microelectronic packages also often referred to as hybrid packages multi chip module housings or ic packages are used to package and thereby protect sensitive electronic components and complete electrical assemblies from harsh environmental conditions including high temperature shock and vibration resistance. Rubalit 708 s with 96 al 2 o 3. Over 150 us companies produce or supply electronic ceramics.

Kyocera ecu substrates provide high density circuit design high temperature durability good heat dissipation and high reliability with multilayer ceramics. Printed resistors and high current capacity trough conductive line structures are also available. This ceramic material is characterized by its extremely high strength and thermal conductivity. The outstanding surface quality on both sides makes it the perfect companion for any commercial thick film paste and even makes it suitable for a number of thin film applications sputtering.

Substrates made from rubalit alumina ceramics. The materials and products are described in this article. The most economically important types of electronic ceramics include substrates integrated circuit ic packages and multichip modules capacitors ferrites insulators piezoelectrics and superconductors world electronics development 1998.